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FEATURES 44 V Supply Maximum Ratings VSS to VDD Analog Signal Range Low On Resistance (100 max) Low Power (ISUPPLY < 75 A) Fast Switching Break-Before-Make Switching Action Plug-in Replacement for DG408/DG409 APPLICATIONS Audio and Video Routing Automatic Test Equipment Data Acquisition Systems Battery-Powered Systems Sample-and-Hold Systems Communication Systems
LC2MOS 4-/8-Channel High Performance Analog Multiplexers ADG408/ADG409
FUNCTIONAL BLOCK DIAGRAMS
ADG408
S1 S1A DA S4A D S1B DB S8 1-OF-8 DECODER S4B 1-OF-4 DECODER
ADG409
A0 A1 A2 EN
A0
A1
EN
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG408 and ADG409 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The ADG408 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1, and A2. The ADG409 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF. The ADG408/ADG409 are designed on an enhanced LC2MOS process that provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit breakbefore-make switching action, preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs. The ADG408/ADG409 are improved replacements for the DG408/DG409 analog multiplexers.
1. Extended Signal Range. The ADG408/ADG409 are fabricated on an enhanced LC2MOS process, giving an increased signal range that extends to the supply rails. 2. Low Power Dissipation. 3 Low RON. 4. Single-Supply Operation. For applications where the analog signal is unipolar, the ADG408/ADG409 can be operated from a single rail power supply. The parts are fully specified with a single 12 V power supply and will remain functional with single supplies as low as 5 V.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) 2003 Analog Devices, Inc. All rights reserved.
ADG408/ADG409-SPECIFICATIONS
DUAL SUPPLY1
Parameter ANALOG SWITCH Analog Signal Range RON DRON LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) ADG408 ADG409 Channel ON Leakage ID, IS (ON) ADG408 ADG409 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tTRANSITION tOPEN tON (EN) tOFF (EN) Charge Injection OFF Isolation Channel-to-Channel Crosstalk CS (OFF) CD (OFF) ADG408 ADG409 CD, CS (ON) ADG408 ADG409 POWER REQUIREMENTS IDD ISS IDD 100 200 20 -75 85 11 40 20 54 34 1 5 1 5 500 100 200 10 85 150
(VDD = +15 V, VSS = -15 V, GND = 0 V, unless otherwise noted.)
B Version -40 C to +25 C +85 C VSS to VDD 40 100 15 0.5 1 1 1 1 125 40 100 15 0.5 1 1 1 1 T Version -55 C to +25 C +125 C
Unit
Test Conditions/Comments
VSS to VDD V W typ 125 W max W max 50 100 50 100 50 2.4 0.8 nA max nA max nA max nA max nA max V min V max mA max pF typ ns typ ns max ns min ns typ ns max ns typ ns max pC typ dB typ dB typ pF typ pF typ pF typ
VD = 10 V, IS = -10 mA VD = +10 V, -10 V VD = 10 V, VS = Test Circuit 2 VD = 10 V; VS = Test Circuit 3 VS = VD = 10 V; Test Circuit 4 10 V; 10 V;
50 100 50 100 50 2.4 0.8
8
10
8
10
VIN = 0 or VDD f = 1 MHz RL = 300 W, CL = 35 pF; VS1 = 10 V, VS8 = 10 V; Test Circuit 5 RL = 300 W, CL = 35 pF; VS = 5 V; Test Circuit 6 RL = 300 W, CL = 35 pF; VS = 5 V; Test Circuit 7 RL = 300 W, CL = 35 pF; VS = 5 V; Test Circuit 7 VS = 0 V, RS = 0 W, CL = 10 nF; Test Circuit 8 RL = 1 kW, f = 100 kHz; VEN = 0 V; Test Circuit 9 RL = 1 kW, f = 100 kHz; Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz
120 250 10 125 225 65 150 10 85 150 20 -75 85 11 40 20 54 34
120 250 10 125 225 65 150
pF typ pF typ 1 5 1 5 500 mA typ mA max mA typ mA max mA typ mA max VIN = 0 V, VEN = 0 V
VIN = 0 V, VEN = 2.4 V
NOTES 1 Temperature ranges are as follows: B Version: -40C to +85C; T Version: -55C to +125C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
-2-
REV. B
ADG408/ADG409 SINGLE SUPPLY1 (V
Parameter ANALOG SWITCH Analog Signal Range RON LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) ADG408 ADG409 Channel ON Leakage ID, IS (ON) ADG408 ADG409 DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH CIN, Digital Input Capacitance DYNAMIC CHARACTERISTICS2 tTRANSITION tOPEN tON (EN) tOFF (EN) Charge Injection OFF Isolation Channel-to-Channel Crosstalk CS (OFF) CD (OFF) ADG408 ADG409 CD, CS (ON) ADG408 ADG409 POWER REQUIREMENTS IDD IDD 100 200
DD
= 12 V, VSS = 0 V, GND = 0 V, unless otherwise noted.)
B Version -40 C to +25 C +85 C 0 to VDD 90 0.5 1 1 1 1 50 100 50 100 50 2.4 0.8 8 130 10 140 60 5 -75 85 11 40 20 54 34 1 5 500 100 200 10 8 130 10 140 60 5 -75 85 11 40 20 54 34 1 5 500 90 0.5 1 1 1 1 50 100 50 100 50 2.4 0.8 10 T Version -55 C to +25 C +125 C 0 to VDD
Unit V W typ nA max nA max nA max nA max nA max V min V max mA max pF typ ns typ ns typ ns typ ns typ pC typ dB typ dB typ pF typ pF typ pF typ
Test Conditions/Comments
VD = 3 V, 10 V, IS = -1 mA VD = 8 V/0 V, VS = 0 V/8 V; Test Circuit 2 VD = 8 V/0 V, VS = 0 V/8 V; Test Circuit 3 VS = VD = 8 V/0 V; Test Circuit 4
VIN = 0 or VDD f = 1 MHz RL = 300 W, CL = 35 pF; VS1 = 8 V/0 V, VS8 = 0 V/8 V; Test Circuit 5 RL = 300 W, CL = 35 pF; VS = 5 V; Test Circuit 6 RL = 300 W, CL = 35 pF; VS = 5 V; Test Circuit 7 RL = 300 W, CL = 35 pF; VS = 5 V; Test Circuit 7 VS = 0 V, RS = 0 W, CL = 10 nF; Test Circuit 8 RL = 1 kW, f = 100 kHz; VEN = 0 V; Test Circuit 9 RL = 1 kW, f = 100 kHz; Test Circuit 10 f = 1 MHz f = 1 MHz f = 1 MHz
pF typ pF typ mA typ mA max mA typ mA max VIN = 0 V, VEN = 0 V VIN = 0 V, VEN = 2.4 V
NOTES 1 Temperature ranges are as follows: B Version: -40C to +85C; T Version: -55C to +125C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice.
REV. B
-3-
ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS 1
(TA = 25C, unless otherwise noted.)
ORDERING GUIDE
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +25 V VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -25 V Analog, Digital Inputs2 . . . VSS - 2 V to VDD + 2 V or 20 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA Peak Current, S or D (Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . -40C to +85C Extended (T Version) . . . . . . . . . . . . . . . -55C to +125C Storage Temperature Range . . . . . . . . . . . -65C to +150C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150C CERDIP Package, Power Dissipation . . . . . . . . . . . . 900 mW qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300C PDIP Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117C/W Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 260C TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155C/W qJC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50C/W SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW qJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220C
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at A, EN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
Model1 ADG408BN ADG408BR ADG408BRU ADG408TQ ADG409BN ADG409BR ADG409BRU ADG409TQ
Temperature Range -40C to +85C -40C to +85C -40C to +85C -55C to +125C -40C to +85C -40C to +85C -40C to +85C -55C to +125C
Package Option2 N-16 R-16A RU-16 Q-16 N-16 R-16A RU-16 Q-16
NOTES 1 To order MIL-STD-883, Class B processed parts, add /883B to T grade part numbers. 2 N = PDIP; Q = CERDIP; R = 0.15" Small Outline IC (SOIC); RU = Thin Shrink Small Outline Package (TSSOP).
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
-4-
REV. B
ADG408/ADG409
PIN CONFIGURATIONS (DIP/SOIC/TSSOP) TERMINOLOGY
VDD
A0 1 EN 2 VSS 3 S1
4 16 15 14
Most positive power supply potential. Most negative power supply potential in dual supplies. In single supply applications, it may be connected to ground. Ground (0 V) reference. Ohmic resistance between D and S. Difference between the RON of any two channels. Source leakage current when the switch is off. Drain leakage current when the switch is off. Channel leakage current when the switch is on. Analog voltage on terminals D, S. Channel input capacitance for OFF condition. Channel output capacitance for OFF condition. ON switch capacitance. Digital input capacitance. Delay time between the 50% and 90% points of the digital input and switch ON condition. Delay time between the 50% and 90% points of the digital input and switch OFF condition. Delay time between the 50% and 90% points of the digital inputs and the switch ON condition when switching from one address state to another. OFF time measured between the 80% point of both switches when switching from one address state to another. Maximum input voltage for Logic 0. Minimum input voltage for Logic 1. Input current of the digital input. A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. A measure of unwanted signal coupling through an OFF channel. A measure of the glitch impulse transferred from the digital input to the analog output during switching. Positive supply current. Negative supply current.
A1 A2 GND VDD
A0 1 EN 2 VSS 3 S1A
4
16 15 14
A1 GND VDD S1B
VSS
ADG408
13
ADG409
13
TOP VIEW S2 5 (Not to Scale) 12 S5 S3 S4
6 7 11 10 9
TOP VIEW S2A 5 (Not to Scale) 12 S2B S3A S4A
6 7 11 10 9
GND RON DRON IS (OFF) ID (OFF) ID, IS (ON)
S6 S7 S8
S3B S4B DB
D8
DA 8
ADG408 Truth Table
A2 X 0 0 0 0 1 1 1 1
A1 X 0 0 1 1 0 0 1 1
A0 X 0 1 0 1 0 1 0 1
EN 0 1 1 1 1 1 1 1 1
ON SWITCH NONE 1 2 3 4 5 6 7 8
VD (VS) CS (OFF) CD (OFF) CD, CS (ON) CIN tON (EN) tOFF (EN) tTRANSITION
ADG409 Truth Table
Al X 0 0 1 1
A0 X 0 1 0 1
EN 0 1 1 1 1
ON SWITCH PAIR NONE 1 2 3 4
tOPEN
VINL VINH IINL (IINH) Crosstalk
Off Isolation Charge Injection IDD ISS
REV. B
-5-
ADG408/ADG409-Typical Performance Characteristics
120 TA = 25 C 100 VDD = +5V VSS = -5V
180 TA = 25 C 160 140 VDD = 5V VSS = 0V
80 RON - VDD = +10V VSS = -10V 60
RON -
VDD = +12V VSS = -12V
120 100 VDD = 10V VSS = 0V VDD = 12V VSS = 0V
80
40 VDD = +15V VSS = -15V 20 -15 -10 -5 0 VD (VS) - V 5 10 15
60 40 VDD = 15V VSS = 0V 0 3 6 VD (VS) - V 9 12 15
TPC 1. RON as a Function of VD (VS): Dual Supply Voltage
TPC 4. RON as a Function of VD (VS): Single Supply Voltage
100 90 80
VDD = +15V VSS = -15V
130 120 VDD = 12V VSS = 0V
110 100
70
RON -
60 50
RON -
125 C 85 C
125 C
90 85 C
80
25 C
40 30 -15
70 25 C
-10 -5 0 VD (VS) - V 5 10 15
60
0
2
4
6 VD (VS) - V
8
10
12
TPC 2. RON as a Function of VD (VS) for Different Temperatures
TPC 5. RON as a Function of VD (VS) for Different Temperatures
0.2 TA = 25 C VDD = +15V VSS = -15V
0.04 TA = 25 C VDD = 12V VSS = 0V
LEAKAGE CURRENT - nA
IS (OFF)
LEAKAGE CURRENT - nA
0.1
0.02
ID (ON) 0 ID (OFF) IS (OFF) -0.02
0
ID (OFF) ID (ON)
-0.1
-0.04
-0.2 -15
-10
-5
0 VD (VS) - V
5
10
15
-0.06
0
2
4
6 VD (VS) - V
8
10
12
TPC 3. Leakage Currents as a Function of VD (VS)
TPC 6. Leakage Currents as a Function of VD (VS)
-6-
REV. B
ADG408/ADG409
120 VDD = +15V VSS = -15V 100 tTRANSITION 120 tON (EN) 140 VDD = 12V VSS = 0V tTRANSITION
TIME - ns
tON (EN) 60
TIME - ns
tOFF (EN)
80
100
80
40
60
tOFF (EN)
20
1
3
5
7
9 VIN - V
11
13
15
40
1
3
5
7 VIN - V
9
11
13
TPC 7. Switching Time vs. VIN (Bipolar Supply)
TPC 10. Switching Time vs. VIN (Single Supply)
400 VIN = 5V
300 VIN = 5V
300 tTRANSITION 200
TIME - ns
TIME - ns
200
tON (EN)
tTRANSITION
100 100 tOFF (EN)
tON (EN) tOFF (EN)
0
0 5 7 9 11 VSUPPLY - V 13 15 5 7 9 11 VSUPPLY - V 13 15
TPC 8. Switching Time vs. Single Supply
TPC 11. Switching Time vs. Bipolar Supply
104 VDD = +15V VSS = -15V
104 VDD = +15V VSS = -15V 103
IDD - A
103
ISS - A
102 EN = 2.4V 101 EN = 0V
EN = 2.4V EN = 0V 102 10 100 1k 10k 100k FREQUENCY - Hz 1M 10M
100
10-1
10
100
1k 10k 100k FREQUENCY - Hz
1M
10M
TPC 9. Positive Supply Current vs. Switching Frequency
TPC 12. Negative Supply Current vs. Switching Frequency
REV. B
-7-
ADG408/ADG409
110 VDD = +15V VSS = -15V 100 100
OFF ISOLATION - dB
110 VDD = +15V VSS = -15V
CROSSTALK - dB
90
90
80
80 70
70 1k 10k 100k FREQUENCY - Hz 1M
60
1k
10k 100k FREQUENCY - Hz
1M
TPC 13. Off Isolation vs. Frequency
TPC 14. Crosstalk vs. Frequency
Test Circuits
I DS
VDD VSS
V1
S1
VDD
VSS
S2
D
S VS RON = V1/I DS
D
VS
S8
GND
EN
0.8V VD
ID (OFF)
A
Test Circuit 1. On Resistance
Test Circuit 3. ID (OFF)
VDD
VSS
VDD
VSS
S1
IS (OFF)
VDD
VSS
S1
VDD
VSS D ID (ON) A VD
A
S2 S8
EN
D
S8
0.8V
VS
VS
VD
GND
GND
EN
2.4V
Test Circuit 2. IS (OFF)
Test Circuit 4. ID (ON)
-8-
REV. B
ADG408/ADG409
VDD 3V ADDRESS DRIVE (VIN) 0V 50% 50% VIN tTRANSITION tTRANSITION 90% OUTPUT 2.4V EN GND 90% *SIMILAR CONNECTION FOR ADG409 50 tr < 20ns tf < 20ns A0 S1 A1 S2 THRU S7 A2 S8 VS8 OUTPUT D 300 35pF VS1 VSS VDD VSS
ADG408*
Test Circuit 5. Switching Time of Multiplexer, tTRANSlTlON
VDD 3V ADDRESS DRIVE (VIN) 0V VIN 50 A0
VSS
VDD
VSS S1 VS
A1 S2 THRU S7 A2 S8
80% OUTPUT
80% 2.4V EN
ADG408*
D GND
OUTPUT
300
35pF
tOPEN *SIMILAR CONNECTION FOR ADG409
Test Circuit 6. Break-Before-Make Delay, tOPEN
VDD 3V ENABLE DRIVE (VIN) 0V 50% 50% A0
VSS
VDD
VSS S1 VS
A1 A2 tON (EN) 0.9VO OUTPUT VIN 50 tOFF (EN) 0.9VO EN GND S2 THRU S8
ADG408*
D
OUTPUT
300
35pF
*SIMILAR CONNECTION FOR ADG409
Test Circuit 7. Enable Delay, tON (EN), tOFF (EN)
REV. B
-9-
ADG408/ADG409
VDD VSS VDD A0 VIN A1 A2 VSS
3V
ADG408*
VOUT QINJ = CL VOUT
VOUT VS
RS
S EN GND VIN
D
VOUT CL 10nF
*SIMILAR CONNECTION FOR ADG409
Test Circuit 8. Charge Injection
VDD
VSS
VDD
VSS
VDD A0 A1 A2
VSS
A0 A1
VDD
VSS EN 2.4V
ADG408
D VOUT 1k
1k
A2 S1
ADG408
D 1k VOUT
S1 S8 VS 0V EN GND
S2 S8 VS GND
OFF ISOLATION = 20 LOG VOUT/VIN
CROSSTALK = 20 LOG VOUT/VIN
Test Circuit 9. OFF Isolation
Test Circuit 10. Channel-to-Channel Crosstalk
-10-
REV. B
ADG408/ADG409
OUTLINE DIMENSIONS
16-Lead Plastic Dual In-Line Package [PDIP] (N-16)
Dimensions shown in inches and (millimeters)
16-Lead Standard Small Outline Package [SOIC] Narrow Body (R-16)
Dimensions shown in millimeters and (inches)
0.700 (17.78) BSC
16 1 9 8
0.295 (7.49) 0.285 (7.24) 0.275 (6.99)
16 1
10.00 (0.3937) 9.80 (0.3858)
9 8
0.100 (2.54) BSC 0.015 (0.38) MIN
0.180 (4.57) MAX
0.150 (3.81) 0.135 (3.43) 0.120 (3.05)
0.325 (8.26) 0.310 (7.87) 0.300 (7.62)
4.00 (0.1575) 3.80 (0.1496)
6.20 (0.2441) 5.80 (0.2283)
0.150 (3.81) 0.135 (3.43) 0.120 (3.05)
0.25 (0.0098) 0.10 (0.0039)
1.27 (0.0500) BSC
1.75 (0.0689) 1.35 (0.0531)
0.50 (0.0197) 0.25 (0.0098)
45
0.022 (0.56) 0.018 (0.46) 0.014 (0.36)
0.060 (1.52) SEATING PLANE 0.050 (1.27) 0.045 (1.14)
0.015 (0.38) 0.010 (0.25) 0.008 (0.20)
COPLANARITY 0.10
8 0.51 (0.0201) SEATING 0.25 (0.0098) 0 1.27 (0.0500) 0.33 (0.0130) PLANE 0.40 (0.0157) 0.19 (0.0075)
COMPLIANT TO JEDEC STANDARDS MO-095AC CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
16-Lead Ceramic Dual In-Line Package [CERDIP] (Q-16)
Dimensions shown in inches and (millimeters)
16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16)
Dimensions shown in millimeters
0.005 (0.13) MIN PIN 1
0.098 (2.49) MAX
16 9
0.310 (7.87) 0.220 (5.59)
5.10 5.00 4.90
1
8
0.200 (5.08) MAX
0.840 (21.34) MAX
0.060 (1.52) 0.015 (0.38) 0.150 (3.81) MIN
16
9
0.320 (8.13) 0.290 (7.37) 0.015 (0.38) 0.008 (0.20)
4.50 4.40 4.30
1 8
6.40 BSC
0.200 (5.08) 0.125 (3.18) 0.023 (0.58) 0.014 (0.36)
0.100 (2.54) BSC
0.070 (1.78) SEATING PLANE 0.030 (0.76)
15 0
PIN 1 1.20 MAX 0.20 0.09 0.65 BSC 0.30 0.19 COPLANARITY 0.10 SEATING PLANE 8 0 0.75 0.60 0.45
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
0.15 0.05
COMPLIANT TO JEDEC STANDARDS MS-153AB
REV. B
-11-
ADG408/ADG409 Revision History
Location 3/03--Data Sheet changed from REV. A to REV. B. Page
Changes to Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
C00027-0-3/03(B)
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
-12-
REV. B
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